ST unveils the VNH9030AQ, an integrated full-bridge DC motor driver that can handle a range of automotive applications.

GlobalFoundries announces plans to create a new centre for advanced packaging and testing of US-made essential chips.

CES took place in Las Vegas earlier this month and highlighted the latest innovations and new trends for 2025.

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).

Intel, the semiconductor giant, is once again the centre of rumours around potential buyers for its struggling chip business.

The 5G private network has been deployed under a Memorandum of Understanding (MOU) between the National Robotarium and ...

Inelco Hunter has announced the availability of its new 7-inch Touch Display, featuring a 24 Bit RGB interface.

NXP has secured a €1 billion loan from the European Investment Bank (EIB) to advance the company’s RDI investment.

Vertical Compute raises funds to develop vertical integrated memory and compute technology to tackle AI memory issues.

The additions include the G9EK-1-UTU and G9EK-1-E which provide compact yet high-capacity gasless interruption for large ...

HighTec EDV-Systeme, a provider of automotive C/C++ compiler solutions, has announced that it has added support for Nuclei ...

SkyWater has announced the launch of ThermaView to meet the evolving needs of thermal imaging system designers.