Abstract: The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network ...

Modern chips, which are becoming increasingly complex and integrated, are gradually propelling the entire semiconductor industry forward, making chip quality and related technological breakthroughs ...

Danish technology and engineering conglomerate Danfoss Group's high-end electronic components plant in Nanjing, Jiangsu province will commence production in the second half, after the opening of its ...

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