Key market opportunities in the data center semiconductor sector include the dominance of the power stage segment by 2029 due ...
Abstract: The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network ...
Cooling fans are eating up valuable motherboard space just as AI laptops need it most. Could Ventiva's fanless ionic airflow ...
Armored Likho BusySnake Stealer, a Python-based infostealer first disclosed by Kaspersky, is actively targeting government ...
The module <NameOfSystemFile> failed to load. Make sure the binary is sorted at the specified path or debug it to check for problems with the binary or dependent .DLL ...
Data center builder Crusoe Inc. is reportedly in talks to raise a $3 billion funding round. Bloomberg on Thursday cited ...
The Falcon-821CRS is an 8MP Color HDR Camera built on the Onsemi AR0821 image sensor. Equipped with a multi exposure HDR architecture achieving 120dB dynamic range and a USB 3.0 interface, this camera ...
Kaspersky says the attacks use phishing, GitHub-hosted payloads, CVE-2025-9491 LNK abuse, and Go2Tunnel-based tunneling.
Abstract: Increasing the power rating of onboard chargers (OBCs) and auxiliary power modules (APMs) is constrained by cost and size. Integrating OBC with APM mitigates these challenges. This article ...
China’s new underwater data center slashes energy use. Could coastal cities be the next frontier for sustainable AI ...
The "Smart Power Fab" is one of the world's largest manufacturing plants for power semiconductors, used in power supplies, ...
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HBC, HBF: Next-gen memories beyond HBM

What will be the next-generation advanced memory to follow ‘High Bandwidth Memory (HBM)’? The global semiconductor industry ...