本文来自“COMSOL”，文章仅代表作者观点，与“环球科学科研圈”无关。 COMSOL 多物理场仿真软件的最新版本带来了 “放电模块”、GPU 加速，以及全面提升软件性能的一系列更新。 COMSOL 于 2024 年 11 月 19 日发布了 COMSOL Multiphysics® 6.3 版本。新版本带来了众多 ...

先进封装已成为半导体行业延续摩尔定律的关键技术。相较于传统芯片制造过程，先进封装通过整合多芯片和制程，将多个半导体组件进行集成，用于提升系统性能，从而更好地应对半导体关键技术和商业化地束缚。先进封装同时对制造过程中的不同工艺提出了 ...

SolidWorks, a supplier of 3D CAD software, has named Comsol as one of its select Solution Partners due to the tight integration of Comsol’s multiphysics simulation software with SolidWorks’ CAD ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...

BURLINGTON, MA. COMSOL, a provider of software solutions for multiphysics modeling, simulation, and application design and deployment, has announced the latest version of its COMSOL Multiphysics ...