Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...
‘Rubbish In, Rubbish Out’ is a common and well-accepted fact in the world of thermal simulation—actually any type of simulation, for that matter. Regardless of the technical capabilities of your ...
To develop the sensor system, it is first necessary to gain an overview of the expected magnetic input signals. The starting points for this effort are the typical specifications of the encoder wheel, ...
As the reality of true 3D IC design nears, engineering teams are keen to manage the heat between the stacked die in order to avoid catastrophic failures. Thermal modeling tops the roster of techniques ...
SAE Transactions, Vol. 106, Section 3: JOURNAL OF ENGINES (1997), pp. 923-939 (17 pages) A comprehensive transient analysis simulation model is used for the calculation of diesel engine performance ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results