President Donald Trump gave a lengthy address at the McDonald’s Impact Summit 2025 in Washington, touching on subjects from ...

Abstract: Through-silicon via (TSV) is one of the key enabling technologies of stacked 3D ICs. However, the crosstalk among the adjacent TSVs decreases the performance of TSV bus and deteriorates the ...

Abstract: This paper explores the optimization of Costas arrays search through the utilization of bidirectional circular linked lists. Costas arrays are integral in various applications, such as ...

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