This is a standalone desktop tool built to assist engineers and students in performing concrete mix design calculations based on the ACI 211.1-22 standard. Developed using Python, Tkinter, and other ...

Western University and Fraunhofer ISC test biochar as an SMC additive, finding improved strength and lower density in molded ...

MAGEMin is a Gibbs energy minimization solver package, which computes the thermodynamically most stable assemblage for a given bulk rock composition and pressure/temperature condition. It also returns ...

ADI Predictstreet, FIFA’s Official Prediction Market Partner of the FIFA World Cup 2026™, will enable secure, transparent, and scalable ...

A section of steel rebar unexpectedly protruded through the concrete on I-15 in Murray on Thursday morning, forcing transportation crews to close lanes and make emergency repairs before reopening the ...

Beijing National Laboratory for Molecular Sciences, Joint Laboratory of Polymer Science and Materials, State Key Laboratory of Polymer Physics and Chemistry, Institute of Chemistry, Chinese Academy of ...

今天，来自台积电的一则关于玻璃基板的消息，引爆了资本市场。截至6月16日收盘，玻璃基板指数大涨6.98%。 有媒体报道，设备端传出消息，近期台积电向供应链发布CoWoS玻璃基板开发计划，确定携手ABF载板大厂Ibiden与面板厂群创，共同验证玻璃基板导入下一代CoWoS先进封装的可行性。供应链人士指出，三方的合作及模拟验证显示，玻璃基板可使封装翘曲相关指标COP（Chip on Package）改 ...

目前硅晶片热膨胀系数与传统有机基板差异较大，容易在温度变化时产生应力并影响封装可靠度。 相较之下，玻璃材料热膨胀系数更接近硅晶片特性，有助于降低热应力、减少裂纹与焊点疲劳问题; 玻璃基板有效弹性模数提升31%，代表整体刚性更高，可提供更佳支撑能力。 其中随着HBM的堆叠层数不断增加，基板刚性将成为支撑大型封装的重要条件。

台积电首次公开披露与Ibiden、群创联合验证玻璃基板导入CoWoS先进封装的成果。数据显示，玻璃基板可使封装翘曲改善16%、热膨胀系数降低19%、弹性模量提升31%，供电电阻和电感分别降低27%和42%。台积电同时透露，封装竞争正从CoWoS向CoPoS迁移，玻璃基板产业化验证阶段正式开启。 AI芯片越做越大，封装材料的天花板正在被重新定义。 据Digitimes 6月16日报道，台积电近期首次 ...