Intel的下一代重大工艺节点将是Intel 14A，等效于1.4nm，从路线图上看大约会在2026年左右推出。 它的最大亮点，就是将在业界首次采用全新的高NA EUV ...

根据最新消息，AMD和NVIDIA在PC平台上使用的处理器和显卡都停留在4nm级别。然而，Intel的酷睿Ultra 200S系列虽然升级为3nm级别的制造工艺，但只是采用台积电初代N3B节点规划，并非苹果、高通、联发科等公司的第二代N3E节点。

even though Intel already produces 4nm chips domestically using its Intel 4 process. Under CEO Pat Gelsinger, Intel has made strides to catch up with TSMC and Samsung. Gelsinger's 2021 return ...

这一系列新品引起了广泛关注，特别是B580显卡，它基于Intel Xe2-HPG架构，采用台积电先进的4nm工艺制程。 B580显卡相较于上一代Alchemist系列，在晶体管 ...

Qualcomm's latest chip for PCs, Snapdragon X, announced at the 2025 Consumer Electronics Show, is aimed at the mid-range ...

On top of that, the Arizona fab is still fairly new, having only reached phase 1. For the moment, the fab appears to have its hands full with 4nm chips.

TSMC is expected to maintain full utilization of its 5/4nm and 3nm fabrication capacity through the end of this year, though uncertainties loom regarding policy changes following US President ...