3nm工艺！AMD Zen6处理器曝光：采用N3E技术 2027年推出
根据最新消息，AMD和NVIDIA在PC平台上使用的处理器和显卡都停留在4nm级别。然而，Intel的酷睿Ultra200S系列虽然升级为3nm级别的制造工艺，但只是采用台积电初代N3B节点规划，并非苹果、高通、联发科等公司的第二代N3 ...
来自MSN11 个月
14A 1.4nm领衔！Intel代工正式成立：宣布八大全新制造工艺
Intel的下一代重大工艺节点将是Intel 14A，等效于1.4nm，从路线图上看大约会在2026年左右推出。 它的最大亮点，就是将在业界首次采用全新的高NA EUV ...
Microsoft’s Copilot-focused Surface Pro and Laptop PCs ship with Snapdragon and Intel options
At an event in New York City on Thursday, Microsoft unveiled two additions to the Surface line of PCs. The new Surface Pro and Surface Laptop both arrive ...
来自MSN2 个月
Intel 12月3日将发布Arc新显卡“战斗法师”，B580/B570主板同步亮相
这一系列新品引起了广泛关注，特别是B580显卡，它基于Intel Xe2-HPG架构，采用台积电先进的4nm工艺制程。 B580显卡相较于上一代Alchemist系列，在晶体管 ...
Digi Times19 天
Biden's chip strategy highlights TSMC over Intel as his term approaches its end
even though Intel already produces 4nm chips domestically using its Intel 4 process. Under CEO Pat Gelsinger, Intel has made strides to catch up with TSMC and Samsung. Gelsinger's 2021 return ...
Qualcomm brings its Snapdragon X chips to mid-range Windows laptops and desktops
Qualcomm's latest chip for PCs, Snapdragon X, announced at the 2025 Consumer Electronics Show, is aimed at the mid-range ...
Digi Times23 天
TSMC sees 5/4nm, 3nm fab capacity fully loaded until year-end
TSMC is expected to maintain full utilization of its 5/4nm and 3nm fabrication capacity through the end of this year, though uncertainties loom regarding policy changes following US President ...