Recently exposed manifests reveal that Intel has begun shipping test samples of its next-generation server and desktop ...

TSMC's strong FY24 performance driven by AI chip demand and 3nm chip production, with continued growth projected despite ...

快科技1月20日消息，三星虽然在3nm工艺节点上野心勃勃，首次引入GAA全环绕晶体管，但是良品率始终上不去，无法大规模量产，消息称只有区区20％，这也连累了自家的Exynos手机处理器。

根据最新消息，AMD和NVIDIA在PC平台上使用的处理器和显卡都停留在4nm级别。然而，Intel的酷睿Ultra200S系列虽然升级为3nm级别的制造工艺，但只是采用台积电初代N3B节点规划，并非苹果、高通、联发科等公司的第二代N3 ...

这一代PC平台上，AMD、NVIDIA无论是处理器还是显卡，都停留在4nm级别，Intel的酷睿Ultra 200S系列虽然升级为3nm，不过是台积电初代N3B，而不是苹果、高通、联发科的第二代N3E。

Shares of Taiwan Semiconductor Manufacturing Co. (TSMC) are up in premarket trading Thursday on strong demand for its ...

随着云计算和人工智能（AI）技术的迅猛发展，数据中心的需求不断增加。英伟达（NVIDIA）近日推出了一款革命性的AI处理器——H100，这款处理器不仅在性能上达到新的高度，还通过先进的架构设计重新定义了数据中心的计算能力。H100的发布不仅标志着英伟达在数据中心市场的持续创新，也引发了产业链的广泛关注，令人期待其在实际应用中的表现和潜在市场影响。

According to the leaker, AMD's next-generation GPUs based on its unified GPU technology known as "UDNA" will be fabricated on TSMC's N3E process. N3E is the second generation of TSMC's N3 process and ...

Neil is a freelance tech journalist with 20 years of experience in IT. He’s the host of the popular Tech Talks Daily Podcast, picking up… A month later, underfire Intel CEO Pat Gelsinger revealed an ...

这一代PC平台上，AMD、NVIDIA无论是处理器还是显卡，都停留在4nm级别，Intel的酷睿Ultra 200S系列虽然升级为3nm，不过是台积电初代N3B，而不是苹果 ...

Shares of Taiwan Semiconductor Manufacturing (NYSE: TSM), or TSMC for short, rose after the semiconductor contract ...