Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

A novel panel-level packaging technology, Hybrid PLP, reduces costs by enabling the processing of multiple wafers on a large 650mm x 650mm panel. It enhances reliability and flexibility for advanced ...

This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional ...

Researchers have developed a groundbreaking flux-less technology for fine-pitch applications in semiconductor manufacturing. This innovative technique eliminates the need for traditional flux ...

Revolutionary layer transfer approach that enables nanometer-precision release of ultra-thin bonded, deposited or grown layers from silicon carrier substrates using an IR laser and specially ...

A groundbreaking trillion-transistor GPU, developed by a team at NVIDIA, promises massive leaps in graphics and AI processing power. This innovation marks a significant milestone in computing ...

This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.

This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Recent industry reports predict a 10% annual growth in the global market for industrial robots, signaling accelerated demand for robotics in precision manufacturing. From 2025 and onward, robotic ...

Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows how EOTPR accurately isolates chiplet interconnect defects ...

GlobalFoundries (GF) has restarted silicon interposer production in the U.S., providing its 65PKG interposer tech with no die origin limits. This flexible manufacturing approach supports aerospace, ...