Up to 4,608 signal contacts and an array of modules adapts the mass-interconnect device to interface a wide range of inputs ...

Mixed-Signal Devices' latest timing portfolio delivers sub-20-fs jitter, 2-GHz performance and rugged thermal stability, ...

Morse Micro's MM6108-EKH05-Light wireless developer platform received Matter certification from the Connectivity Standards ...

Bulk-acoustic-wave filter technology has become an essential ingredient in enhancing Wi-Fi performance by mitigating ...

Once considered science fiction, the quantum computer is moving ever closer to reality. What steps need to be taken to have a ...

An increasingly connected world has led to a massive ramp up of the number of IoT devices being developed. Here are some of ...

Unlike their traditional predecessors, the code underpinning software-defined vehicles is arguably even more important than ...

This article debunks the myths surrounding the application of machine-learning technologies to smart edge devices.

Mass production for STMicroelectronics' turnkey Bluetooth/Wi-Fi modules, developed with Qualcomm, is underway.

The result is the development of the UltraCMOS+ RF SOI platform, which includes proprietary semiconductor processes, product ...

As an example, for a configuration of 576 elements and 16 beams, the number of VAPs is 9,216 per array. If one considers using a discrete vector modulator as the VAP, which typically is 3 × 3 mm and ...

6. The resistor measurement revealed a value of 2.085 mΩ at 35 kHz. The measurement looks very solid and shows 2.085 mΩ at 35 kHz. As the frequency increases, the lead inductance becomes apparent and ...