Technology announces the launch of the MCPF1525 Power Module, a highly integrated device with a 16V Vin buck converter that ...

The new power amplifier module (PAM) from NEC Corporation is a compact, high-efficiency PAM for the sub-6GHz band designed ...

The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...

Now, a researcher team at the US Department of Energy’s National Renewable Energy Laboratory (NREL; recently renamed as the ...