ROHM has developed the 32-bit D/A converter IC (DAC chip) and evaluation board designed for flagship models in the MUS-IC[tm] ...

IAR, a global leader in embedded development solutions, announces its support for the THA6 Gen2 series automotive-grade MCUs from Tongxin Microelectronics Co., Ltd. (TMC). This collaboration, achieved ...

TASKING is introducing the winIDEA Tool Qualification Support Package (TQSP). The ISO-compliant debugging solution allows ...

Böblingen, 21. Januar 2025 – Keysight Technologies hat AppFusion vorgestellt, ein Netzwerk-Transparenz-Partnerprogramm, das ...

HighTec EDV-Systeme GmbH, a leading provider of automotive C/C++ compiler solutions, adds support for Nuclei System ...

Type," that achieves approximately 90% size reduction (by volume) compared to its predecessors. Maintaining high vibration ...

ROHM has begun offering samples of the industry’s smallest* terahertz (THz) wave oscillation and detection devices utilizing ...

München, 16. Januar 2025 – Alps Alpine bietet mit dem Haptic Reactor „U-Type“ einen kompakten Vibrationsaktuator, der im ...

In response to the increasing demands of Software-Defined Vehicles (SDV), Mahindra initiated a strategic partnership with ...

Bangkok, Thailand – 14. Januar 2025 – Die Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) hat den Grundstein für eine neue Backend-Halbleiterfertigung in Samut Prakan, südlich von Bangkok, gelegt.

CES, LAS VEGAS, 7.Januar 2025 – QNX, ein Geschäftsbereich von BlackBerry Limited (NYSE: BB; TSX:BB), Vector und TTTech Auto gaben heute ein mehrjähriges, globales Projekt zur Zusammenarbeit, Entwicklu ...

125W × 8ch high-power array significantly improves measurement distance and resolution in LiDAR applications Willich-Münchheide, Germany, January 07, 2025 – ROHM has developed a high output laser ...