Ethernet auto-negotiation; multiphysics to avoid overdesign; PCB design reuse; mobile LLM quantization; modeling BSPDNs.

A new technical paper, Agentic Hardware Design as Repository-Level Code Evolution, was published by researchers at Nvidia ...

In next-generation silicon, AI can interpret system behavior at scale, but only if observability is designed into the fabric ...

At the recent Data Center World 2026 in Washington, D.C., one message came through louder than ever: AI infrastructure is ...

AI scalability will require full-stack co-optimization, not just bigger data centers. AI workloads require a 10X compute ...

Onsemi to buy Synaptics; IBM's 7Å chip w/40% more SRAM area; 1nm MoS2 nanotubes; AI pressure points; memory updates; $250M ...

We nod at it, we put it on slides, and we move on. But the goalposts keep moving. Things that used to live comfortably at the ...

ChipAgents has introduced Renoir, an agentic large language model (LLM) whose name means “renew.” In early chip design ...

On-die monitors, localized analytics, and lifecycle data are giving architects new ways to close the gap between design ...

Supports higher throughput, reduced cycle time, and lower cost per package, while enabling integration of increasingly ...

Researchers from Google and University of California, Berkeley published a technical paper titled “Google’s Training Supercomputers from TPU v2 to Ironwood: Architectural Stability, Scale, Resilience, ...

Researchers from University of Wisconsin-Madison and AMD Research and Advanced Development published a technical paper titled “Eidola: Modeling Multi-GPU Network Communication Traffic in Distributed ...