Applied Materials unveils more advanced chipmaking gear for 3D stacking architectures

Chipmaking equipment giant Applied Materials Inc. is trying to make life easier for its chip fabrication plant customers, so ...
IEEE Spectrum on MSN

Future transistor stacking plans start to diverge

IBM chooses a different path from Intel, Samsung, and TSMC ...
Phys.org

Samsung Develops New, Highly Efficient Stacking Process for DRAM

Samsung Electronics today announced that it has developed the first all-DRAM stacked memory package using ‘through silicon via’ (TSV) technology, which will soon result in memory packages that are ...
Semiconductor Engineering

Optimizing Wafer Edge Processes For Chip Stacking

Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...