本文主要介绍在进行防护电路设计时,需要特别留意的防护元件位置及PCB Layout走线方式等事项,适用于目前市面上各式不同封装的防护元件。 1. ESD/EOS保护元件配置位置的注意事项 图一 :拆解保护元件在PCB Layout时配置位置的各项参数 如图一L1 - 指PCB Layout 时 ...
在集成电路应用设计中,项目原理图设计完成之后,就需要进行PCB布板的设计。PCB设计是一个至关重要的环节。设计结果的优劣直接影响整个设计功能。因此,合理高效的PCB Layout是芯片电路设计调试成功中至关重要的一步。本次我们就来简单讲一讲PCB Layout的 ...
I came across an article on PCB layout in Electronic Design magazine. It’s a pretty good article and I am glad to see the trade magazines realize we care as much about PCB layout as the bus-caching ...
在DCDC电源电路中,PCB的布局对电路功能的实现和良好的各项指标来说都十分重要。今天我们以Buck电路为例,分析如何进行合理PCB layout布局以及设计中的注意事项。 一、功率回路 如图1(a)和1(b) 展示的分别是上管开通和关断时的电流回路,即我们通常说的功率 ...
Duplicate complex circuit blocks effortlessly to reduce design time, ensure consistency, and cut production costs—all with Altium Designer's PCB Layout Replication. PCB Layout Replication in Altium ...
When current flows through a conductor it becomes an inductor, when there is an inductor there is an electromagnetic field (EM). This can cause a variety of issues during PCB layout if you don’t plan ...
This series of articles discusses the different steps of PCB development from the basics of creating a design schematic with specific requirements, to finalizing a board and preparing it for ...
Through the use of IR’s Class D audio chipsets, class D audio amplifiers are achieving superior efficiency and audio quality in today’s audio market. To optimize the performance of class D audio ...
Wonderful PCB offers a full suite of reverse engineering and cloning services tailored to a wide range of industries and applications: ...
Printed-circuit-board (PCB) substrate material, like FR-4 glass epoxy, is a poor conductor of heat. Conversely, copper is an excellent conductor of heat. So, more copper area on a PCB is ideal from a ...
It is a good day for design review! Today’s board is the MuBook, a Lattepanda Mu SoM (System-on-Module) carrier from [LtBrain], optimized for a NAS with 4 SATA and 2 NVMe ports. It is cheap to ...
Siemens has introduced a new artificial intelligence system designed to automate complex engineering processes.