The Open Compute Project Foundation (OCP) has teamed up with the JEDEC Solid State Technology Association to set up a standard for chiplet design. The two standards bodies are developing the Chip Data ...
ARLINGTON, Va.--(BUSINESS WIRE)--In an extraordinary leap forward for the chiplet industry, the groundbreaking collaboration between the Open Compute Project Foundation (OCP) and JEDEC is set to usher ...
Tenstorrent, the Jim Keller-led AI chip company, is taking the lead on an industry effort to create open standards for chiplet-based silicon designs. The Open Chiplet Atlas (OCA) ecosystem was ...
Arm Holdings plc is working to deliver high-efficiency infrastructure standards for artificial-intelligence data centers to help address rising energy demands in conjunction with the Open Compute ...
Leading semiconductor companies called for stronger adoption of open chiplet standards at the OCP APAC Summit 2025 in Taipei, highlighting a growing industry consensus around modular architectures and ...
Progress used to be made by leaps and bounds in the never-ending race to improve the performance of the latest generation of supercomputers. But now, scientists are hitting a wall. High-performance ...
The information-rich content lineup at the Chiplet Summit February 6-8 includes several keynote discussions that will explore industry efforts to create a chiplet design and manufacturing ...
L-R: Arteris’ Schirrmeister, Cadence’s Bhatnagar, Expedera’s Karazuba, Keysight’s Slater, Siemens EDA’s Rinebold, and Synopsys’ Posner. SE: There’s a lot of buzz and activity around every aspect of ...
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
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