JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...

Chip and silicon intellectual property technology company Rambus Inc. today announced HBM4E Memory Controller IP, a new solution that delivers breakthrough performance with advanced reliability ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the industry’s leading HBM4E Memory Controller IP, ...

Delivering unrivaled memory bandwidth in a compact, high-capacity footprint, has made HBM the memory of choice for AI/ML and other high-performance computing workloads. HBM3 as the latest generation ...

AI training data sets are constantly growing, driving the need for hardware accelerators capable of handling terabyte-scale bandwidth. Among the array of memory technologies available, High Bandwidth ...

Samsung has begun shipping engineering samples of its HBM4E memory to chip designers, according to industry disclosures tied ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Astera Labs, the global leader in semiconductor-based connectivity solutions for AI infrastructure, today announced that its Leo Memory Connectivity Platform ...

What is the most important factor that will drive the Nvidia datacenter GPU accelerator juggernaut in 2024? Is it the forthcoming “Blackwell” B100 architecture, which we are certain will offer a leap ...

Intel recently demonstrated a new type of DIMM memory technology called Multiplexer Combined Rank (MCR), also referred to as MRDIMMs, that provides up to 2.3X better performance for HPC workloads and ...