New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.

New COMs from congatec fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards.

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...

The power modules target electric drive systems with power density, lower losses, & heat control, covering voltage & current ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of a new Schottky barrier diode (SBD)-embedded silicon carbide (SiC) ...

Since GSM modems have been equipped with a GPS receiver and a micro-controller, they offer unlimited application opportunities with lower procurement costs and shorter development times. Navigation, ...

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...

The RN171 is a small form factor, ultra-low power embedded TCP/IP module measuring only 27 x 18 x 3.1 mm. The RN171 is a full-featured 802.11 b/g surface mount module. Due to its small form factor and ...