电子工程专辑

【VLSI特稿】存储：中科院微所联合超弦首次实现4层堆叠3D 2T0C存储 ...

Kioxia铠侠, Paper T1.4, A Multi-Stacked Cell Array Architecture with Wafer-to-Wafer Cu Direct Bonding for Ultra-High-Density 3D Flash Memory beyond 1,000 Word ...